.Phase field simulation of the void destabilization and splitting processes in interconnects under....[J]:Modelling and Simulation Materials Science and Engineering,2022,Vol. 30(1)

.Phase field simulation of healing and growth of voids in interconnects under electric field induc....[J]:European Journal of Mechanics - A,2022,Vol. 94

.Phase field simulation of the instability and splitting processes of elliptical inclusions in int....[J]:AIP Advances,2022,Vol. 12(6)

.Phase-field simulation of inclusion evolution in {110}-oriented single crystal metal interconnect....[J]:Applied Physicas A,2022,128

.Phase field simulation of intragranular microvoids evolution due to surface diffusion in stress f....[J]:Transactions of Nanjing University of Aeronautics and Astronautics,2022,Vol. 39(3)

.The evolution of intragranular microcracks caused by interface migration induced by electromigrat....[J]:Journal of Mechanics of Materials and Structures,2021,Vol. 16(4)

黄佩珍,黄佩珍-1.Finite element simulation of the morphological evolution of inclusions in interconnects due to st...:Computational Materials Science,2020

黄佩珍,.Numerical simulations of intergranular microcracks in interconnect lines due to surface diffusion...:rans. Nanjing Univ. Aeronaut. Astronaut.,,2019

黄佩珍,.The evolution of intragranular voids under interface migration induced by stress migration:Lixue Xuebao,2018

黄佩珍,.Effect of interconnect linewidth on the evolution of intragranular microcracks due to surface dif...:J. Mech. Mater. Struct.,2018