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Degree:Doctoral Degree in Engineering
School/Department:College of Aerospace Engineering

Huang Peizhen

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Education Level:西安交通大学

Alma Mater:西安交通大学

Paper Publications

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Numerical simulations of intergranular microcracks in interconnect lines due to surface diffusion induced by stress- electro- and thermo-migration
Date of Publication:2019-12-01 Hits:

Affiliation of Author(s):航空学院
Journal:rans. Nanjing Univ. Aeronaut. Astronaut.,
Translation or Not:no
Date of Publication:2019-12-01
Date of Publication:2019-12-01

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