Journal:Modelling and Simulation Materials Science and Engineering
Document Type:J
Volume:Vol. 30
Issue:1
Translation or Not:no
Date of Publication:2022-01-08
Included Journals:SCIE
Date of Publication:2022-01-08
Huang Peizhen
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Education Level:西安交通大学
Alma Mater:西安交通大学
Paper Publications
Phase field simulation of the void destabilization and splitting processes in interconnects under electromigration induced surface diffusion
Date of Publication:2022-01-08 Hits: