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[1].Multi points temperature measurement of infrared scanning method on surface mount technology.[C]:The 18th International Conference on Electronic Packaging Technology,2017
[2].Effect of the Second-Phase Particle Distribution on the Brittle Fracture Behavior of Sn-3Ag-0.5Cu....[J]:J. Electron.Mater,2023,52:3394-3400
[3].Effect of Aging Time on Ductile-Brittle Transition Behaviors of Sn-3.5Ag Solder..[J]:J.Electron.Mater,2022,52:471-476
[4].Effect of Ag3Sn on fracture behaviors of Sn-3.5Ag lead-free solder during in-situ tensile test at....[J]:J.of Materi Eng andPerform,2023,33:8236-8241
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