Title of Paper:Effect of Ag3Sn on fracture behaviors of Sn-3.5Ag lead-free solder during in-situ tensile test at low temoerature

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Impact Factor:2.036

DOI number:10.1007/s11665-023-08532-x

Journal:J.of Materi Eng andPerform

Funded by:国家重点实验室项目

Key Words:crack propagation,fracture toughness, in-situ tensile test, intermetallic alloys, second-phase particles, Sn-3.5Ag solder

Abstract:n situ tensile tests on Sn-3.5Ag lead-free solder were performed with different rates of 10 μm/s and 300 μm/s at − 198 °C liquid nitrogen temperature. Microstructure evolution and deformation behavior of Sn-3.5Ag solder were observed by optical metallographic microscopy. The morphological influence of the second-phase particles Ag3Sn on fracture behaviors was investigated by scanning electron microscopy. The results showed that plastic deformation occurred at the low tensile rate, while no fracture toughness was observed at the high tensile rate. Several fracture modes were observed, including intergranular fracture and transgranular fracture. The morphology and distribution of the second-phase particles had a significant impact on the fracture behavior of solder. The long rod-shaped second-phase particles perpendicular to the tensile direction were difficult to fracture, while the parallel second-phase particles were broken into segments. The smaller second-phase particles barely deformed, and the voids nearby provided a favorable pathway for fracture.

Discipline:Engineering

Document Type:J

Volume:33

Page Number:8236-8241

Translation or Not:no

Date of Publication:2023-07-31

Included Journals:SCI