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Paper Publications
Multi points temperature measurement of infrared scanning method on surface mount technology.The 18th International Conference on Electronic Packaging Technology.2017
Effect of the Second-Phase Particle Distribution on the Brittle Fracture Behavior of Sn-3Ag-0.5Cu Solder.J. Electron.Mater.2023,52:3394-3400
Effect of Aging Time on Ductile-Brittle Transition Behaviors of Sn-3.5Ag Solder..J.Electron.Mater.2022,52:471-476
Effect of Ag3Sn on fracture behaviors of Sn-3.5Ag lead-free solder during in-situ tensile test at low temoerature.J.of Materi Eng andPerform.2023,33:8236-8241
Patents
一种在线无损监测锡及其合金发生低温相变的方法
一种扩展服役工作温度范围的组合合金软钎焊焊接结构的制备方法
一种测定锡及锡合金样品中白锡转变为灰锡比例的方法
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Research Projects
软钎料合金与接头在极限环境下的微观组织演变与损伤, National Natural Science Foundation of China (NSFC), 2016/01/01-2019/12/31, 已结题
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