点击次数：
影响因子：2.047
DOI码：10.1007/s11664-022-10013-1
发表刊物：J.Electron.Mater
项目来源：国家重点实验室项目
关键字：Sn-3.5Ag solder，ductile-brittle transition temperature (DBTT)，high-temperature aging treatment，Charpy impact test
摘要：A method of decreasing the ductile–brittle transition temperature (DBTT) of Sn-3.5Ag solder by aging treatment has been found to allow the solder to serve at lower temperatures. Charpy impact tests under various temperatures (from −150°C to 20°C) were performed on Sn-3.5Ag solder after 150°C aging treatment, and the morphology of second-phase particles was also acquired, compared with the in situ aging test to analyze the influence of second-phase particles. The results show that with the increase of aging time, the DBTT of the impact curve first decreases and then increases, and the DBTT of impact curve is the lowest at 48 h. Combined with the in situ aging morphology of second-phase particles, precipitation, fusion, and coarsening of Ag3Sn particles are the reason for the change in DBTT. In summary, aging treatment can decrease the DBTT value of Sn-3.5Ag solder, so that the solder can have a greater toughness area. That is, the solder after aging treatment will be able to achieve service at lower temperatures.
论文类型：期刊论文
学科门类：工学
文献类型：J
卷号：52
页面范围：471-476
是否译文：否
发表时间：2022-10-26
收录刊物：SCI