点击次数：
影响因子：2.047
DOI码：10.2139/ssrn.4156624
发表刊物：J. Electron.Mater
项目来源：国家重点实验室项目
关键字：SAC305 solder，ductile-brittle fracture，second-phaseparticles，intermetalliccompounds
摘要：The low-temperature impact test was used to examine the fracture morphology of Sn-3Ag-0.5Cu (SAC305) solder. The second-phase distribution of Ag3Sn and Cu6Sn5 particles on the grain boundary of SAC305 solder was obtained using a nanometer-scale focused ion beam and observed using a transmission electron microscope. The results show that as the temperature drops, the fracture mode of SAC305 solder shifts from ductile to brittle, and that the fracture mode is primarily influenced by crystal morphology. On the grain boundaries of the crystal, a large number of Ag3Sn particles and fewer Cu6Sn5 particles are discovered. The compositional analysis of the nanometer-scale fracture morphology reveals that the majority of the Cu elements are dispersed in the Sn matrix. The phase diagram and Sn activity help to understand this occurrence. The inhibitory effect of Ag on the creation of Cu compounds is further discussed, which not only promotes the connection between the soldering material and the Cu solder disc, but also reduces the fracture problem produced by the Cu6Sn5 second-phase particles.
论文类型：期刊论文
学科门类：工学
文献类型：J
卷号：52
页面范围：3394-3400
是否译文：否
发表时间：2023-05-07
收录刊物：SCI