点击次数：
影响因子：2.036
DOI码：10.1007/s11665-023-08532-x
发表刊物：J.of Materi Eng andPerform
项目来源：国家重点实验室项目
关键字：crack propagation,fracture toughness, in-situ tensile test, intermetallic alloys, second-phase particles, Sn-3.5Ag solder
摘要：n situ tensile tests on Sn-3.5Ag lead-free solder were performed with different rates of 10 μm/s and 300 μm/s at − 198 °C liquid nitrogen temperature. Microstructure evolution and deformation behavior of Sn-3.5Ag solder were observed by optical metallographic microscopy. The morphological influence of the second-phase particles Ag3Sn on fracture behaviors was investigated by scanning electron microscopy. The results showed that plastic deformation occurred at the low tensile rate, while no fracture toughness was observed at the high tensile rate. Several fracture modes were observed, including intergranular fracture and transgranular fracture. The morphology and distribution of the second-phase particles had a significant impact on the fracture behavior of solder. The long rod-shaped second-phase particles perpendicular to the tensile direction were difficult to fracture, while the parallel second-phase particles were broken into segments. The smaller second-phase particles barely deformed, and the voids nearby provided a favorable pathway for fracture.
论文类型：期刊论文
学科门类：工学
文献类型：J
卷号：33
页面范围：8236-8241
是否译文：否
发表时间：2023-07-31
收录刊物：SCI