刘奎
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- 博士生导师 硕士生导师
- 电子邮箱：
- 所在单位：机电学院
- 职务：教授
- 学历：研究生(博士)毕业
- 办公地点：明故宫校区 A15-357
- 性别：男
- 联系方式：liukui@nuaa.edu.cn
- 学位：哲学博士学位
- 主要任职：Professor
- 毕业院校：National University of Singapore
- 所属院系：机电学院
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- ,X. Ding, G.C. Lim, C.K. Cheng, D.L. Butler, K.C. Shaw, K. Liu and W.S. Fong.Fabrication of micro size diamond tool using focused ion beam.[J]:Journal of Micromechanics and Microengineering,2008,18(7)
- K. Liu, X.P. Li and M. Rahman,.Characteristics of ultrasonic vibration assisted ductile cutting of tungsten carbide.[J]:International Journal of Advanced Manufacturing Technology,2008,35(7-8):833-841
- ,K.S. Woon, M. Rahman, F.Z. Fang, K.S. Neo and K. Liu.Investigation of tool edge radius effect in micromachining: a FEM simulation approach.[J]:Journal of Materials Processing Technology,2008,195(1-3):204-211
- ,S. Arefin, X.P. Li, M. Rahman and K. Liu.The upper bound of tool edge radius for nanoscale ductile cutting of silicon wafer.[J]:International Journal of Advanced Manufacturing Technology,2007,31(7-8):655-662
- ,X.P. Li, M.B. Cai, K. Liu and M. Rahman.Characteristics of ductile mode chip formation in nanoscale cutting of brittle materials.[J]:International Journal of Abrasive Technology,2007,1(1):37-58
- K. Liu, X.P. Li and S.Y. Liang,.The mechanism of ductile chip formation in cutting of brittle materials.[J]:International Journal of Advanced Manufacturing Technology,2007,33(9-10):875-884
- K. Liu, X.P. Li, M. Rahman, K.S. Neo and X.D. Liu,.A study of the effect of tool cutting edge radius on ductile cutting of silicon wafers.[J]:International Journal of Advanced Manufacturing Technology,2007,32(7-8):631-637
- ,S. Arefin, X.P. Li, M.B. Cai, M. Rahman, K. Liu and A.A.O. Tay.The effect of cutting edge radius on a machined surface in the nanoscale ductile mode cutting of silicon wafer.[J]:Proceedings of the Institution of Mechanical Engineers Part B: Journal of Engineering Manufacture,2007,221(2):213-220
- ,M. Sharif Uddin, K.H.W. Seah, M. Rahman, X.P. Li and K. Liu.Performance of single crystal diamond tools in ductile mode cutting of silicon.[J]:Journal of Materials Processing Technology,2007,185(1-3):24-30
- K. Liu, X.P. Li, M. Rahman and X.D. Liu,.Study of ductile mode cutting in grooving of tungsten carbide with and without ultrasonic vibration assistance.[J]:International Journal of Advanced Manufacturing Technology,2005,24(5-6):389-394