标题：
Copper Deposits with High Tensile Strength and Elongation Electroformed in an Ultra-Low-Concentration Sulfate Bath without Additives
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所属单位：
机电学院
发表刊物：
JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE
关键字：
copper deposits electroforming mechanical properties ultra-low-concentration
摘要：
Superior mechanical properties of copper are needed in industries to meet high application requirement. In this study, an electroformed copper with superior mechanical properties is achieved by using a simple ultra-low-concentration copper sulfate bath containing neither chloride nor organic additives. Copper deposits obtained in the copper sulfate concentrations ranging from 30 to 60 g/L exhibit high tensile strength and elongation simultaneously. A maximum tensile strength of 256 MPa is achieved, with an elongation ratio of 31%, at a copper sulfate concentration of 30 g/L, while a maximum elongation ratio of 43% is achieved, with a tensile strength of 216 MPa, at a concentration of 50 g/L. It has been found that the copper sulfate concentration affected the hydrogen content, grain arrangement and orientation index of copper deposits which determine their mechanical properties. When the copper sulfate concentration is less than 30 g/L, the excessive hydrogen content of the deposits thus produced leads to poor compactness and inferior mechanical properties. At concentrations over 50 g/L, a disordered arrangement of grains and a significant increase in the peak of (111) lead to an increase in the tensile strength but a decrease in the elongation ratio. This approach provides an effective and economical method for the copper deposits achieving superior mechanical properties.
ISSN号：
1059-9495
是否译文：
否
发表时间：
2017-03-01
合写作者：
Shen, Chunjian,朱荻,Ren, Jianhua
通讯作者：
朱增伟
发表时间：
2017-03-01
学位：工学博士学位
职称：教授
所在单位：机电学院