标题：
A bulk of uniform nanocrystalline copper with superior comprehensive mechanical properties electroformed in an ultra-low sulfate concentration bath without additives
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所属单位：
机电学院
发表刊物：
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
关键字：
Nanocrystalline Electroforming Microstructure Mechanical properties
摘要：
Nanocrystalline copper has a high potential to meet high application requirement of a variety of new industries for its unique mechanical, physical and chemical properties. But its disappointingly low ductility limits its application. This paper provides a reliable and economical preparation method of nanocrystalline copper with superior comprehensive mechanical properties. In an ultra-low sulfate concentration bath (20 g/L) without additives, by strong electrolyte flushing and regulating cathodic working current density from 1 to 6 A/dm(2), copper deposits with different nanostructure is electroformed because of high electrochemical polarization. The microstructure and mechanical properties of copper deposits are investigated. Except of the deposits of 6 A/dm(2), the copper deposits exhibit good comprehensive mechanical properties in tensile tests at room temperature. In particular, a bulk of nanocrystalline copper obtained at 4 A/dm2, with uniform grains size (60-70 nm) and random grain orientation, exhibits superior comprehensive mechanical properties, with a high tensile strength of 526 MPa and a high elongation of 30%. The deformation mechanisms of copper deposits are discussed. Fracture observation indicates a feature of ductile fracture.
ISSN号：
0921-5093
是否译文：
否
发表时间：
2017-09-17
合写作者：
Shen, C. J.,朱荻
通讯作者：
朱增伟
发表时间：
2017-09-17
学位：工学博士学位
职称：教授
所在单位：机电学院