面向空间的抗随机力干扰低功耗黏附爪组件

Release time:2024-11-20| Hits:

Type of Patent:Invent

State of Patent:Authorized patents

Authorization number:ZL201811552989.1

Service Invention or Not:no

Authorization Date:2021-11-19

First Author:孙俊

Disigner of the Invention:王金海,张晓龙,宋婷,刘志刚