Test research on wire deflection detection of a diamond wire saw

Affiliation of Author(s):机电学院

Journal:INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Key Words:Diamond wire saw Semiconductor Special-shaped pieces Wire deflection control

Abstract:Wire deflection affects the shape precision of workpiece during the profile cutting process with diamond wire saw. This study proposes a method for solving this problem using wire deflection detection, called light projection method. This method is based on the space position of the diamond wire. This research also analyzes the effects of wire deflection on shape precision, develops a detection and control device that allows feedback control according to the change in wire projection position, judges the wire position change, and uses this device to perform validation tests with polycrystalline silicon materials. The test shows that this detection and controlling device can effectively control the wire deflection phenomenon in the process of diamond wire cutting process. The roundness of a polysilicon with 20 mm thickness and phi 20 mm diameter can be controlled within 0.05 mm, enabling significant improvement in the cutting shape precision and cutting stability.

ISSN No.:0268-3768

Translation or Not:no

Date of Publication:2017-07-01

Co-author:吴勤,Lida Shen,岳伟栋,张斌

Correspondence Author:lzd

Date of Publication:2017-07-01