Title of Paper:Effects of Thermal Conductivity of Airframe Substrates on the Dynamic Ice Accretion Process Pertinent to UAS Inflight Icing Phenomena

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Journal:International Journal of Heat and Mass Transfer

Document Type:J

Volume:131

Page Number:1184-1195

Translation or Not:no

Included Journals:SSCI

Co-author:Y. Liu, ZC. Zhang and H. Hu