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    房晓龙

    • 教授
    • 招生学科专业:
      机械工程 -- 【招收博士、硕士研究生】 -- 机电学院
      航空宇航科学与技术 -- 【招收硕士研究生】 -- 机电学院
      机械 -- 【招收博士、硕士研究生】 -- 机电学院
    • 学历:南京航空航天大学
    • 学位:工学博士学位
    • 所在单位:机电学院
    • 联系方式:025-84896862
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    Multiple slit electrochemical micromachining using a single wire and a constant inter-electrode voltage

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    所属单位:机电学院

    发表刊物:INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

    关键字:Electrochemical micromachining Multiple wire Machining efficiency Inter-electrode voltage Surface integrity

    摘要:Fabrication of micro-slit array in difficult to machine materials is a considerable challenge due to its rigorous surface integrity requirements. This paper proposed a novel method for multiple slit electrochemical micromachining using a single wire and a specific apparatus was developed. The wire is spooled through a specific pulley with multiple grooves to generate a multiple-wire face. Thus, the wire tension and the wire travelling direction would be the same in each wire machining branch. A simplified flow field and electric model illustrated that each machining branch has the same electric supply and the same wire travelling status, as well as the same flow field, which is of great benefits for producing arrayed structures with high consistency. Experiments verified that the inter-electrode voltage as well as the slit width decreased with the increase of electrode amount and the maximum electrode feeding rate was limited. To maintain a constant inter-electrode, the output of the pulse generator was adjusted to a suitable value depending upon the wire amount. Compared with a constant output voltage, the largest electrode feeding rate of each single electrode and the total feeding rate are improved. Finally, a task was designed to compare multi-slit ECMM, HS-WEDM, and LS-WEDM in machining efficiency and surface integrity. It indicated multi-slit ECMM is a feasible alternative for machining arrayed structures requiring good surface integrity in high efficiency.

    ISSN号:0268-3768

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    发表时间:2019-10-01

    合写作者:吴云华,Tong, Pinzhou,曾永彬

    通讯作者:房晓龙