所属单位：材料科学与技术学院
发表刊物：J Mater Sci Mater Electron
摘要：In order to understand the reliability relationship between solderability and oxygen content which on the surface of Au–20Sn solders, the wettability, microstructure and solderability of Au–20Sn solders with different oxygen content have been investigated in this study. Results showed that oxygen content significantly influence the wettability of Au–20Sn solders because of oxide films, and the worst wettability was achieved by containing 102 ppm oxygen with spreading area reducing to 52.3 mm2, which was about 45.8% smaller than that of the solder contained 16 ppm oxygen. In addition, the flux provided a good wetting behavior of Au–20Sn solders when the oxygen content was relatively high. The main oxide films on the surface of Au–20Sn solders were verified that composed of SnO and SnO2 by way of X-ray diffractometer determination, and the reason for the formation of surface oxides has been briefly analyzed and discussed. Meanwhile, the microstructure displayed varying degree deterioration with the increase of oxygen content, and the surface oxide started to be appeared in Au–20Sn solders when the oxygen content reached 42 ppm. On the other hand, the increase of oxygen content would induce pores and cracks of soldered joints, which may finally deteriorate the reliability, and the solderability of solders on Cu substrate indicated that the oxygen content is preferably less than 20 ppm when Au–20Sn solders are used for fluxless bonding. © 2018, Springer Science+Business Media, LLC, part of Springer Nature.
ISSN号：0957-4522
是否译文：否
发表时间：2018-12-01
合写作者：王刘珏,刘晗
通讯作者：薛松柏
发表时间：2018-12-01