所属单位：材料科学与技术学院
发表刊物：APPLIED SCIENCES-BASEL
关键字：Sn-58Bi solder paste epoxy resin wettability shear strength microstructure
摘要：Sn-58Bi solder has been widely used for microelectronics packaging due to its low melting point temperature, good wetting performance, good mechanical properties, and low cost. Compared with Sn-Bi solder alloy and Sn-Pb solder alloy, the strength and plasticity of Sn-Bi solder are not enough, due to the higher brittleness of bismuth, which thus limits the application of Sn-Bi solder. In order to improve the properties of Sn-Bi solder, a novel solder paste strengthened with resin was developed by mixing epoxy resin (ER) with Sn-58Bi solder, which enhanced the joint strength at a low cost. Aimed at the electronic industry, in this study, the spreadability of the novel solder paste was investigated, and the mechanical properties and microstructure of solder joints after reflow soldering were tested and analyzed. The results showed that when the content of epoxy resin was in the optimum range, the shear strength was significantly higher, reaching nearly twice that of Sn-58Bi solder alone.
ISSN号：2076-3417
是否译文：否
发表时间：2018-11-01
合写作者：刘露,刘思怡
通讯作者：薛松柏
发表时间：2018-11-01