Thermosiphon: A thermal aware NUCA architecture for write energy reduction of the STT-MRAM based LLCs
点击次数:
发表刊物:IEEE/ACM International Conference on Computer-Aided Design (ICCAD)
刊物所在地:Irvine, CA, USA
论文类型:论文集
论文编号:978-1-5386-3093-8
文献类型:C
是否译文:否
发表时间:2017-12-14
收录刊物:EI