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Affiliation of Author(s):材料科学与技术学院

Title of Paper:A novel high dielectric constant acrylic resin elastomer nanocomposite with pendant oligoanilines

Journal:COMPOSITES PART B-ENGINEERING

Key Words:Acrylic resin Oligoaniline High permittivity Dielectric property

Abstract:Much attention has been paid to develop polymer-based composites utilized in electronic devices in the last two decades. This work introduces a high permittivity percolative composite material, fabricated by grafting the oligoaniline (OANI) onto the chains of acrylic resin elastomer (AE) through oxidative coupling polymerization (referred to the resulting nanocomposites as AE-g-OANI). The OANI is chosen as the filler because it combines the advantages of polyaniline (PANI) and good solubility. The composite films with different contents of OANI were prepared by the solution casting method and the physical blending PANI/AE composite films were also prepared for a comparison. The results show that the permittivity of AE-g-OANI is significantly improved compared to the pure AE, i.e. the dielectric constants of AE-g-OANI are 227 and 168 at 10(2) and 10(3) Hz, respectively, approximately 64 and 48 times of AE (3.5), as the volume fractions of OANI get close to the percolation threshold (f(c) = 8.75). Meanwhile, the dielectric loss of AE-g-OANI composite (0.38 and 0.21 at 10(2) and 10(3) Hz) is much less than that of the PANI/AE composite (1.57 and 0.95 at 10(2) and 10(3) Hz) near the percolation threshold. We demonstrate that the origin of the obtained AE-g-OANI composite with high permittivity and low dielectric loss is closely relevant to the well dispersion of OANI particles, which creates more microcapacitors and enhances the MWS effect. In addition, the elongation at break and elastic modulus of AE-g-OANI composite near the percolation threshold are 820% and 5.3 MPa, respectively, at room temperature.

ISSN No.:1359-8368

Translation or Not:no

Date of Publication:2019-11-01

Co-author:Shao, Jing,Wei, Lei,Wu, Sen-Qiang,Yang, Yan-Hua,Ren, Hua

Correspondence Author:Wang Jingwen