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所属单位：能源与动力学院

发表刊物：JOURNAL OF MICROMECHANICS AND MICROENGINEERING

关键字：ultra-thin flat heat pipe supporting pillars thermal performance thermal resistance

摘要：In this paper, a novel ultra-thin flat heat pipe (UFHP) with an active steam chamber of 76 x 46 x 0.2mm(3) is successfully designed, fabricated and tested. The innovation point of the UFHP is its thinner thickness with only 0.65 mm total thickness which can reduce the space for heat dissipation in electronic devices and accommodate its increasingly compact structure. Another innovation point is the design of supporting pillars. It is etched in the UFHP to avoid the ultra-thin chamber deformation and can also supply vertical channels for liquid reflux. Thermal performance is assessed and results reveal that the optimal operating power of the UFHP is 7.1-13.7 W at different tilt angles and liquid filling rates. When the filling rate is 1.05 and the tilt angle is 90 degrees, it has the best performance, and the minimum average thermal resistance is 1.15 degrees C W-1 with the input power varying from 7.1 to 13.7 W. When the input power is 15.9 W and the evaporator temperature is 60 degrees C, the heat transfer performance of the vertically placed UFHP is perfect and with a thermal conductivity of 800 W m(-1) K-1. This research is of great significance for the production of UFHP with ultra-thin thickness and good heat transfer performance.

ISSN号：0960-1317

是否译文：否

发表时间：2019-11-01

合写作者：Zhang, Han,张汉清,Zhang, Ping,Yan, Lipei

通讯作者：史波