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所属单位：材料科学与技术学院
发表刊物：JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
关键字：AU-SN SOLDER ELECTRICAL CHARACTERISTICS INTERFACIAL REACTION TEMPERATURE ALLOYS
摘要：In this study, MoCu20/Cu joints via eutectic bonding recipe with AuSn20 solder were obtained to investigate the effect of -ray irradiation on the microstructure and mechanical properties of the solder joints. Firstly, the experimental results showed that the number and size of voids in joints were gradually increased during irradiating process due to the migration and agglomeration of irradiation-induced vacancies. Secondly, the (Au,Ni)Sn and (Ni,Au)(3)Sn-2 IMC layers and Au-rich joints were formed by the activation of interfacial reaction between Au-Sn solder and plating metal. Thirdly, the failure mode was altered from ductile fracture to brittle fracture, and the shear strength of joint was decreased by 37.23% after 1000h -ray irradiation in the results of mechanical test. In summary, the -ray irradiation has a highly detrimental influence on the AuSn20 solder joint.
ISSN号：0957-4522
是否译文：否
发表时间：2019-05-01
合写作者：Wen, Li,Xue, Songbai,薛松柏,Wang, JianXin,Long, Weimin,Zhong, Shujuan
通讯作者：李万文,薛松柏