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所属单位：机电学院

发表刊物：INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

关键字：Diamond wire saw Semiconductor Special-shaped pieces Wire deflection control

摘要：Wire deflection affects the shape precision of workpiece during the profile cutting process with diamond wire saw. This study proposes a method for solving this problem using wire deflection detection, called light projection method. This method is based on the space position of the diamond wire. This research also analyzes the effects of wire deflection on shape precision, develops a detection and control device that allows feedback control according to the change in wire projection position, judges the wire position change, and uses this device to perform validation tests with polycrystalline silicon materials. The test shows that this detection and controlling device can effectively control the wire deflection phenomenon in the process of diamond wire cutting process. The roundness of a polysilicon with 20 mm thickness and phi 20 mm diameter can be controlled within 0.05 mm, enabling significant improvement in the cutting shape precision and cutting stability.

ISSN号：0268-3768

是否译文：否

发表时间：2017-07-01

合写作者：吴勤,沈理达,岳伟栋,张斌

通讯作者：刘志东