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所属单位：电子信息工程学院

发表刊物：IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION

关键字：Equivalent circuit model (ECM) frequency selective surfaces (FSSs) measurement miniaturization printed circuit board spatial filter square loop through-silicon vias (TSVs)

摘要：This paper explores the potential of using vias for the miniaturization of frequency selective surfaces (FSSs). A new concept of knitting the loop-type FSS elements in 2.5-D is proposed, where successive segments of the loop are placed alternately on the two surfaces of the substrate and then interconnected through vias. A 2.5-D square-loop FSS (2.5-D SL-FSS) based on the proposed method is designed with the inclusion of ten vias at each side and characterized by a full-wave simulator. The transmission curves indicate a significant size reduction with a figure-of-merit.0/p = 16, where.0 is the free-space wavelength of resonant frequency and p is the periodicity of unit element. In addition, the frequency response of this miniaturized FSS is also stable for various incident angles and polarizations. Furthermore, a general equivalent circuit model (ECM) is developed for 2.5-D SL-FSS by combining the prevailing electrical models of planar square loop and through-silicon vias. A wide set of parametric simulations for various element sizes, substrate thicknesses, and via counts are carried out with this ECM. Then, its performance is assessed on the basis of root-mean-square error (RMSE) criteria by comparing the results with appropriate electromagnetic simulations. The findings suggest that the ECM has sufficient accuracy for estimating the resonant frequency of 2.5-D SL-FSS with the RMSE values close to 3%. Moreover, the proposed concept of knitting is further validated by measuring two physical prototypes of the 2.5-D SL-FSS and the experimental results show a good consistency with full-wave simulations.

ISSN号：0018-926X

是否译文：否

发表时间：2017-05-01

合写作者：Hussain, Tauseef,Kayani, Jahangir Khan,Majid, Irfan

通讯作者：曹群生