Impact Factor:

13.1

Journal:

Composites Part B: Engineering

Key Words:

Nanocomposites; Micromechanical modeling; Temperature; Interfacial behavior; Mechanical properties

Abstract:

One of the challenges to be addressed in the reasonable prediction of the mechanical properties of nanocomposites at elevated temperatures is the quantitative characterization of the temperature-dependent interfacial behavior. In this study, the temperature-dependent mechanical properties for graphene nanoplatelets (GNPs) reinforced polymer-matrix nanocomposites are modeling based on the nonlinear interfacial shear stress transfer mechanism. Besides, the influence of interfacial debonding, polymer matrix plasticity, thermomechanical parameters of components, and their evolution with temperature, as well as the orientation, dimensions and volume fractions of GNPs is considered. The Young’s modulus, yield/ultimate strength, and stress-strain relationships at elevated temperatures are predicted and are verified by the available experimental data. Compared to the extended room-temperature models previously established, the proposed model considering the microscopic structures achieves higher prediction accuracy with only basic material parameters input. Furthermore, the temperature-dependent interfacial mechanical behavior is analyzed. The initial strain of debonding and the maximum debonding ratio of the interface at elevated temperatures are calculated. The micromechanical modeling establishes the quantitative relationships between the temperature-dependent interfacial behavior and the mechanical properties of nanocomposites. This study deepens the understanding of the mechanical behavior of the interface and their evolution with temperature, which contributes to the prediction of the high-temperature mechanical performance and reliability analysis of nanocomposites.

Indexed by:

Journal paper

Discipline:

Engineering

Document Type:

J

Volume:

270

Page Number:

111143

ISSN No.:

1359-8368

Translation or Not:

no

Date of Publication:

2023-12-14

Included Journals:

SCI

Co-author:

Lei Cao,Pingping Yang,Jun Jiang,Ying Li

First Author:

Mengqing Yang

Correspondence Author:

Weifu Sun,Weiguo Li