Hits:
Title of Paper:Lihong Xie, Xibo Yuan, Wenbo Wang. Thermal modeling of fan-cooled plate-fin heatsink considering air temperature rise for virtual prototyping of power electronics. IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 10, no. 11, pp. 1829‒1839, Nov. 2020.
Indexed by:Journal paper
Translation or Not:no
Pre One:Lihong Xie, Xinbo Ruan, Haonan Zhu, Yu-Kang Lo. Common-mode voltage cancellation for reducing the common-mode noise in DC-DC converters. IEEE Transactions on Industrial Electronics. vol. 68, no. 5, pp. 3887‒3897, May 2021.
Next One:Lihong Xie, Xibo Yuan. Common-mode current reduction at DC and AC sides in inverter systems by passive cancellation. IEEE Transactions on Power Electronics, vol. 36, no. 8, pp. 9069‒9079, Aug. 2021.
