Thermosiphon: A thermal aware NUCA architecture for write energy reduction of the STT-MRAM based LLCs
- 发表刊物:IEEE/ACM International Conference on Computer-Aided Design (ICCAD)
- 刊物所在地:Irvine, CA, USA
- 论文类型:论文集
- 论文编号:978-1-5386-3093-8
- 文献类型:C
- 是否译文:否
- 收录刊物:EI
- 发表时间:2017-12-14