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Affiliation of Author(s):材料科学与技术学院

Journal:ADVANCES IN MATERIALS SCIENCE AND ENGINEERING

Key Words:LEAD-FREE SOLDER MECHANICAL-PROPERTIES MICROSTRUCTURE JOINTS NI EVOLUTION BI

Abstract:The effect of trace amount of Ga on the inoxidizability and wettability of Sn-0.5Ag-0.7Cu-0.05Pr solders was investigated systematically by means of microstructure characterizations. The results indicate that the wettability and oxidation resistance properties are remarkably improved with addition of trace amount of Ga. Moreover, it is observed that the trace amount of Ga in Sn-0.5Ag-0.7Cu-0.05Pr solders refines the matrix microstructure. The relationship between wettability and oxidation resistance was put into deep study. And Ga was found to be enriched on the surface of the molten solder, which benefited the properties correspondingly. The results of this study can stimulate the use of low-silver Sn-Ag-Cu-Pr solders for various applications.

ISSN No.:1687-8434

Translation or Not:no

Date of Publication:2017-01-01

Co-author:Xu Jiachen,Xue Songbai,Luo Dongxue,Xue Peng

Correspondence Author:wang heng chang,Xue Songbai