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Affiliation of Author(s):材料科学与技术学院

Journal:JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Key Words:LEAD-FREE SOLDERS MECHANICAL-PROPERTIES ADDITIONS STRENGTH JOINTS GA AL

Abstract:Effect of Pr element on the wettability, microstructure, interface morphology and mechanical property of Sn-0.3Ag-0.7Cu-0.5Ga-xPr solder has been studied. The result exhibits that the wettability of solders could significantly be improved by adding an approximate amount of Pr, for the forming of well-distributed PrSn3 IMCs could serve as the sites of heterogeneous nucleation, subsequently leading to the refinement of beta-Sn matrix and reducing the growth of IMCs. Therefore, the thickness of the IMC layers at the interface (Cu plate/solder) is reduced, implying that the morphology is optimized. The promotion of mechanical properties is also correlated to the refining of IMC layer.

ISSN No.:0957-4522

Translation or Not:no

Date of Publication:2017-06-01

Co-author:Wang, He,Xue Songbai,Wang, JianXin

Correspondence Author:wang heng chang,Xue Songbai