一种低功耗高集成高可靠空间黏附装置

Release time:2024-11-20| Hits:

Type of Patent:Invent

State of Patent:Authorized patents

Authorization number:ZL.202010431372.5

Service Invention or Not:no

Authorization Date:2021-12-24

First Author:王金海

Disigner of the Invention:孙俊