Affiliation of Author(s):材料科学与技术学院

Journal:IEEE J. Photovoltaics

Abstract:In this paper, we presented a novel low-cost method for diamond-wire-sawn (DWS) multicrystalline silicon (mc-Si) wafer texturation based on the metal-Assisted chemical etching process with Ag/Cu dual elements and nanostructure rebuilding (NSR) treatment to remove the saw marks and to realize uniform invert pyramid textured structures. Benefiting from both the increased optical absorption and better passivation, an efficiency of 18.71% for invert pyramid mc-Si solar cells from a DWS wafer with a standard size of 156 × 156 mm2was obtained, which was 0.58% and 2.33% absolutely higher than that (18.13%) of the traditional mc-Si solar cell and than that (16.38%) of the black mc-Si solar cell without NSR treatment, respectively. © 2011-2012 IEEE.

ISSN No.:2156-3381

Translation or Not:no

Date of Publication:2017-01-01

Co-author:郑超凡,蒲天,tangquntao,杨汪扬,陈洁仪,芮春宝,Lily

Correspondence Author:shl