刘奎
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- 博士生导师 硕士生导师
- 电子邮箱：
- 所在单位：机电学院
- 职务：教授
- 学历：研究生(博士)毕业
- 办公地点：明故宫校区 A15-357
- 性别：男
- 联系方式：liukui@nuaa.edu.cn
- 学位：哲学博士学位
- 主要任职：Professor
- 毕业院校：National University of Singapore
- 所属院系：机电学院
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- ,W.J. Guo, L.M.M. Calija, P. Xu, K. Liu and A.S. Kumar.A study on the etching characteristics of atmospheric pressure plasma for single-crystal silicon wafer.[J]:Vacuum,2021,190
- ,Y. Wang, H.H. Su, N. Qian, K. Liu, J.B. Dai, Z.C. Zhao and W.F. Ding.Neck-spinning quality analysis and optimization of process parameters for plunger components: simulation and experimental study.[J]:Chinese Journal of Aeronautics,2021,34:174-191
- R. Huang, X.Q. Zhang, B.P. Ng, A.S. Kumar and K. Liu.Roll-to-roll embossing of optical radial Fresnel lenses on polymer film for concentrator photovoltaics: A feasibility study.[J]:International Journal of Precision Engineering and Manufacturing – Green Technology,2021,8:77-88
- ,N.Y.J. Tan, Z.H. Lim, G.Y. Zhou, K. Liu and A.S. Kumar.Design and fabrication of composite polygonal Fresnel lenses.[J]:Optics Express,2021,29:36516-36534
- ,W.J. Guo, A.S. Kumar, K. Liu and H. Deng.Investigation of electrochemical oxidation behaviors and mechanism of single-crystal silicon (100) wafer under potentiostatic mode.[J]:Coatings,2021,10:568-14
- D.K.W. Neo, K. Liu, R. Huang and H. Wu.Edge grinding characteristics of display glass substrate.[J]:Journal of Manufacturing and Materials Processing,2021,5:20-32
- K. Liu, H. Wu, R. Huang and N.Y.J. Tan,.Ultra-precision machining of micro step pillar array using a straight edge milling tool.[J]:Nanomanufacturing and Metrology,2020,3:260-268
- D.W.K. Neo, K. Liu and A.S. Kumar.High throughput deep-hole drilling of Inconel 718 using PCBN gun drill.[J]:Journal of Manufacturing Processes,2020,57:302-311
- ,J. Guo, K.H. Au, C.N. Sun, M.H. Goh, C.W. Kum, K. Liu, J. Wei, H. Suzuki and R. Kang,.Novel rotating-vibrating magnetic abrasive polishing method for double-layered internal surface finishing.[J]:Journal of Materials Processing Technology,2019,264:422-437
- X.Q. Zhang, H. Deng and K. Liu.Oxygen-shielded ultrasonic vibration cutting to suppress the chemical wear of diamond tools.[J]:CIRP Annals,2019,68:69-72