A study on the etching characteristics of atmospheric pressure plasma for single-crystal silicon wafer
- Impact Factor:3.9
- Journal:Vacuum
- Indexed by:Journal paper
- Document Code:110292
- Discipline:Engineering
- Document Type:J
- Volume:190
- Translation or Not:no
- Included Journals:SCI
- Co-author:W.J. Guo, L.M.M. Calija, P. Xu, K. Liu and A.S. Kumar
- Date of Publication:2021-09-14

