Nanometric ductile cutting characteristics of silicon wafer using single crystal diamond tools
- Impact Factor:2.1
- Journal:Journal of Vacuum Science & Technology B
- Indexed by:Journal paper
- Discipline:Engineering
- Document Type:J
- Volume:27
- Issue:3
- Page Number:1361-1366
- Translation or Not:no
- Included Journals:SCI
- Date of Publication:2009-09-24

