The effect of cutting edge radius on a machined surface in the nanoscale ductile mode cutting of silicon wafer
- Impact Factor:1.9
- Journal:Proceedings of the Institution of Mechanical Engineers Part B: Journal of Engineering Manufacture
- Indexed by:Journal paper
- Discipline:Engineering
- Document Type:J
- Volume:221
- Issue:2
- Page Number:213-220
- Translation or Not:no
- Included Journals:SCI
- Co-author:S. Arefin, X.P. Li, M.B. Cai, M. Rahman, K. Liu and A.A.O. Tay
- Date of Publication:2007-04-24

