Title of Paper:Leakage, heat transfer and thermal deformation analysis method for contacting finger seals based on coupled porous media and real structure models

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Journal:Journal of Mechanical Engineering Science

Discipline:Engineering

First-Level Discipline:Aeronautical and Astronautical Science and Technology

Document Type:J

Volume:234

Issue:10

Page Number:2077–2093

Translation or Not:no

Date of Publication:2020-05-27

Included Journals:SSCI