Affiliation of Author(s):航空学院
Journal:Trans. Nanjing Univ. Aero. Astro.
Abstract:The effect of interconnect linewidth on the evolution of intragranular microcracks due to surface diffusion induced by electromigration is analyzed by finite element method. The numerical results indicate that there exists critical values of the linewidth hc, the electric field χc and the aspect ratio βc. When h>hc, χ<χc or β<βc, the microcrack will evolve into a stable shape as it migrates along the interconnect line. When h≤hc, χ≥χc or β≥βc, the microcrack will split into two smaller microcracks. The critical electric field, the critical aspect ratio and the splitting time have a stronger dependence on the linewidth when h≤6. In addition, the decrease of the linewidth, the increase of the electric field or the aspect ratio is beneficial to accelerate microcrack splitting, which may delay the open failure of the interconnect line. © 2019, Editorial Department of Transactions of NUAA. All right reserved.
ISSN No.:1005-1120
Translation or Not:no
Date of Publication:2019-04-01
Date of Publication:2019-04-01
Huang Peizhen
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Education Level:西安交通大学
Alma Mater:西安交通大学
Paper Publications
Effect of Interconnect Linewidth on Evolution of Intragranular Microcracks Due to Electromigration Analyzed by Finite Element Method
Date of Publication:2019-04-01 Hits: