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所属单位：电子信息工程学院

发表刊物：IEEE Int. Conf. IC Des. Technol., ICICDT - Proc.

摘要：3D stacking technology using in 3D Network-on-Chip (NoC) increases the transistor integration density, but brings serious thermal issues. The high temperature in the chip will have a great impact on the performance and reliability of the chip. In order to reduce the chip temperature and avoid causing hotspots in 3D NoC, this paper proposes a dual-threshold credit-based flow control mechanism. The mechanism can adjust the chip temperature in the network through two temperature thresholds, the max threshold and safety threshold. The experimental results show that the proposed mechanism can effectively reduce the average temperature in the network compared with the conventional credit-based flow control mechanism. © 2019 IEEE.

是否译文：否

发表时间：2019-06-01

合写作者：李向莉,贲睿,吴 宁,周芳

通讯作者：葛芬