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Paper Publications

S.-P. Gao, F. de Paulis, E.-X. Liu, Y.-X. Guo. (2019). Transmission Line Representation of the Capacitive Via-Plate Interaction towards a Capacitor-Free Via Model. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9(11), 2248-2256.

Release time:2024-09-23 Hits:

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高思平

Gender:Male Alma Mater:南京航空航天大学 School/Department:集成电路学院 Business Address:南京航空航天大学(将军路校区)工程训练中心8310-2房间 E-Mail: