标题：
A preparation method for Al/AlN ceramics substrates by using a CuO interlayer
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所属单位：
材料科学与技术学院
发表刊物：
MATERIALS & DESIGN
关键字：
Al/AlN interface Bonding Joining Al-Cu eutectic Microstructure Mechanical properties
摘要：
A novel method for preparing aluminum/aluminum nitride ceramics (Al/AlN) substrates is proposed in this paper. The method included two processes: (1) the surface of AlN was coated with a CuO thick film and sintered; (2) Al foil was put on the pretreated (in process 1) AlN surface and bonded to AlN through pre-heating at 400 degrees C and final heating at 660 degrees C in N-2-H-2 reduction atmosphere. The experimental results obtained by optical and scanning electron microscope (SEM) observations as well as by X-ray diffraction analysis at the cross-sections of the joints and the fracture surfaces, suggest that the reaction mechanism starts with the reaction of CuO with AlN to form CuAlO2, when the AlN coated with CuO is heat-treated at high temperature. A Cu layer is produced by the reduction of CuO and Cu diffuses in the Al foil, forming strong Al/AlN joints. Elongated crystals of Al2Cu are developed in the reaction zone at the interface between Al and AlN. The results of mechanical tests showed that the peeling-off strength of the Al foil from the surface of the AlN substrate reached a value of 15.4 MPa for the Al/AlN couples produced after 30 min of heat treatment at 660 degrees C. [GRAPHICS] .
ISSN号：
0264-1275
是否译文：
否
发表时间：
2017-09-15
合写作者：
费盟,Agathopoulos, Simeon,方军,王彩霞,朱海涛
通讯作者：
傅仁利,Agathopoulos, Simeon,傅仁利
发表时间：
2017-09-15
学位：工学博士学位
职称：教授
所在单位：材料科学与技术学院